產品線
結構組裝
- PUR Hotmelts PUR熱熔膠
- UV Curable Adhesives 紫外光固化接著劑
- Water Based Adhesives 水性膠黏劑
- 2k Acrylic-Adhesives 雙組分丙烯酸接著劑
- Thermally Conductive Adh. 導熱膠
- Gaskets(CIPG/FIPG) 密封膠CIPG/FIPG
- Film based material 膠膜
PCB板級製程
- 2nd level Underfill 底部填充
- Encapsulants / Globtops 密封劑
- UV Curable Adhesives 紫外光固化接著劑
- Electrically Conductive Adh. 導電膠
半導體封裝
- 1st level Underfill 底部填充
- Die Attach Adhesives 晶片接著劑
- → Conductive 導電
- → Non-Conductive 非導電
- EMI Shielding Solutions EMI屏蔽解決方案
- → Compartment Shielding 分段型屏蔽
- → Conformal Shielding 保護型屏蔽
導熱介面材料
- Thermal Gap Filler 導熱填隙劑
- Thermal Gel 熱凝膠
- Thermally Conductive 熱傳導
- Potting 灌封膠
Weldtone Xiamen Factory Capacity
PUR/ECA/UV/2kpu/coating Products Capacity
PUR Hotmelt Monthly
Capacity
1600K (30-300ml)
ECA &UV Products Monthly Capacity
3000K (30ml-600ml)
2K PU Products Monthly Capacity
993T
消費電子解決方案
整機/結構
- CG bonding
- CG Gapfilling
- Back cover
板級應用
- Underfill
- Encapsulation
- BMS protection
配件/穿戴
- TWS
- Cable
- Wireless charger
- VR/AR
模組
- Acoustic module
- Battery module
- Camera module
消費電子結構膠解決
WeldtoneStructural Adhesive
PUR Hotmelt Portfolio
結構膠解決方案
Weldtone Board Level Solutions
底部填充
- Mechanical Reliability
- Thermal Reliability
- Thermal & Humidity Resistance
包封保護
- Moisture barrier
- Mechanical protect
- Barrier for solder splashing
CCM
- Dual cure system
- Fast initial setting
- High thermal resistance
韋爾通底填產品線
WeldtoneCCM solution
Product profolio
Active alignment solution
半導體產品線
底部填充
- 一級底填
包封保護
- 隔腔式電磁遮罩
- 共覆式電磁遮罩
CCM
- 非導電
- 導電DA
- 高導電/導熱DA
- BSP
- Die Attach Film
動力電池創新應用介紹
